Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization,  and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.

The TTVs are 27mm X 27mm BGA packages with 1mm pitch, 0.6mm diameter balls in a partially populated 26X26 array (480 balls). Twelve strategically placed ball sets are available for daisy-chain applications.

All the chips on these TTVs are 381µm (0.015”) thick with approximately 1,000Å thick Au flash on the backside and are underfilled. Other array sizes and configurations, thickness and back-side treatment are optionally available on a custom basis.

Larger array (chip) sizes, package types and multi-chip configurations are also available on a custom basis. Please contact TEA to discuss specific environments.

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