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Phone: 650-961-5900
FAX: 650-227-3814
E-Mail: info@thermengr.com
Santa Clara, CA, USA

*** HOT LINKS ***

TEA presents this information for the benefit of its Web-site visitors and does not warrant, endorse or otherwise take responsibility for any information presented below or actions derived from said information

The links below provide useful thermal engineering information

NIST Heat Transmission Properties of Insulating and Building Materials

Future trends in heat sink design

A Beginner's Guide to Measuring Thermal Conductivity

MatWeb Materials Database

Engineering Materials Properties Listing

List/Links for general thermal information

Conversion Calculator for Units of  THERMAL CONDUCTIVITY

Properties of Materials - Metals

Britney's Guide to Semiconductor Physics

An Alternative Approach to Junction-to-Case Thermal Resistance Measurements

An Introduction to Diode Thermal Measurements (version 6)

Measurement of junction temperature confirms [Laser Diode & LED] package thermal design

Thermal Test Chip Design and Performance Considerations

Practical Considerations in High Power LED Junction Temperature Measurements

Thermal Load Boards – Another Thermal Management Design Tool

Solar Photovoltaic Cell Thermal Measurement Issues

Monitoring Die-Attachment Integrity

Thermal Effect of Die Bond Voids

Thermal Load Boards Improve Product Development Process

Stacked Chip Thermal Model Validation using Thermal Test Chips

Thermal Load Board Design Considerations

Side-by-side comparison of IR & Thermoreflectance using Thermal Test Chip

Thermal design validation techniques

3D Integrated Packaging Approach for High Performance Processor-Memory Module