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Phone: 650-961-5900
FAX: 650-227-3814
E-Mail: info@thermengr.com
Santa Clara, CA, USA

Thanks for your interest in our TECH BRIEFS

These short documents  provide general  information on the thermal testing of semiconductor devices. Each document  covers a specific topic in 2 or 3 pages and are intended to be an on-going  series that will grow in number as questions are submitted to the author, Bernie  Siegal. TEA provides these technical briefs as a service to participants in the  semiconductor thermal measurement, management and modeling field. Suggestions  for additional topics are most welcome.

The technical  briefs are published in a ".pdf" file format that requires Adobe Acrobat Reader  to view and print the contents of the file. If your browser is not yet equipped  with the Acrobat Reader plug-in capability, you can download a free copy of this  program by clicking on the image on the right and following the download  instructions displayed.

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TB-01

Integrated Circuit Thermal Measurement Concepts

TB-02

Diode Temperature Sensing

TB-03

Semiconductor Thermal Measurement Procedure

TB-04

Heating Curves aid thermal characterization

TB-05

Thermal Resistance - Definitions & Explanations

TB-06

Cooling Curves Correct Measurement Data

TB-07

Diode Junction Temperature & Thermal Resistance Measurements

TB-08

Thermal Test System Selection Considerations

TB-09

Diode Temperature Sensor Calibration -  Bath vs. Oven Approaches

TB-10

Thermal Conductivity Measurements - Bond Line Correction

TB-11

LED Array Thermal Measurement  Considerations

TB-12

Implementing TJ Monitoring in  ACOL Burn-in

TB-13

Thermal Testing Guidelines for Power Transistors

TB-14

High Power Transistor Module Thermal Testing

TB-15

Heating Curve Analysis

TB-16

Thermal Test Chip Packaging

TB-17

TIM Thermal Conductivity Measurement Issues

TB-18

 1mA Current Source Reference Design

If you would  like additional information, have topic suggestions, and/or have technical  questions, please contact bsiegal@thermengr.com.

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