New TEA Logo Marc

Phone: 650-961-5900
Santa Clara, CA, USA

Useful Links

TEA presents this information for the benefit of its website visitors and does not warrant, endorse or otherwise take responsibility for any information presented below or actions derived from said information.

MatWeb Materials Database

Engineering Materials Properties Listing

Conversion Calculator for Units of  THERMAL CONDUCTIVITY

Properties of Materials - Metals

Britney's Guide to Semiconductor Physics

An Alternative Approach to Junction-to-Case Thermal Resistance Measurements

An Introduction to Diode Thermal Measurements (version 6)

Measurement of junction temperature confirms [Laser Diode & LED] package thermal design

Thermal Test Chip Design and Performance Considerations

Practical Considerations in High Power LED Junction Temperature Measurements

Thermal Load Boards – Another Thermal Management Design Tool

Solar Photovoltaic Cell Thermal Measurement Issues

Monitoring Die-Attachment Integrity

Thermal Effect of Die Bond Voids

Thermal Load Boards Improve Product Development Process

Stacked Chip Thermal Model Validation using Thermal Test Chips

Thermal Load Board Design Considerations

Side-by-side comparison of IR & Thermoreflectance using Thermal Test Chip

Thermal design validation techniques

3D Integrated Packaging Approach for High Performance Processor-Memory Module

Laser Diode Junction Temperature Measurement Alternatives: An Overview