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Thermal Test Chip

The TTC-1002 Thermal Test Chip is designed to provide a maximum of flexibility for thermal characterization of semiconductor packages. Each die can be used individually or in a square or rectangular array. Strategically placed diode temperature sensors enable temperature measurements to be made in the center, corner and mid-side of an individual die or any configuration array. All diodes, whether in a single die or arrayed die configuration, can be individually addressed, allowing for temperature contour measurements across a die or an array. The two heating resistors on each die can be powered individually or wired in a series or parallel configuration for operation from a single power supply. In an array configuration, there are several resistor series strings that can be individually powered from separate power supplies or paralleled for operation from a single supply. The multiple resistor design allows for thermal measurements with non-uniform heating across the die or array.

The 2.5mm x 2.5mm Unit Cell is shown top right and an example 3x3 array of cells is shown bottom right. The TTC wafers are available in either wire-bond (with inter-cell connection, so only periphery wire-bonding is required) or bump-chip (with each cell electrically isolated) form. Each wafer contains a 52x52 array of unit cells can easily be sawn into various sub-array sizes to meet specific die dimensions in unit cell increments. The wafers can be thinned and backside treated on a custom basis. Wafers can also be supplied with custom designed ReDistribution Layers to put wire bond pads or bumps in specific locations.

For a TTC-1002 datasheet, please click here.

To download the TTC-1002 Application Manual, please click here.

For TTC-1002 Wafer/Chip  Requirements Questionnaire, please click here.                    (Use this document for communicating your specific requirements to TEA .)

For On-Line Chip E-Commerce site, please click here.

Also available are custom single and multiple chip packaging capabilities.

If you would like more information or on thermal test chips or if you have special requirements, please contact us by e-mail using the address shown above. You can also use the TEA message response form.

Phone: 650-961-5900
FAX: 650-227-3814
E-Mail: info@thermengr.com
Santa Clara, CA, USA

TTC-1002-_1
TTC-3x3 Array

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