The TTC-1001 Thermal Test Chip is based on a 1mm X 1mm Unit Cell and is designed to provide a maximum of flexibility for thermal characterization of semiconductor packages. Each Unit Cell can be used individually or in a square or rectangular array. A center diode temperature sensor enables temperature measurements to be made in multiple locations any array configuration. All diodes, whether in a single cell or arrayed cell configuration, can be individually addressed, allowing for temperature contour measurements across an array. The heating resistor in each cell can be powered individually or wired in a series or parallel configuration for operation from a single power supply. In an array configuration, there are several resistor series strings that can be individually powered from separate power supplies or paralleled for operation from a single supply. The multiple resistor design allows for thermal measurements with nonuniform heating across a Unit Cell array.
The 1mm x 1mm TTC-1001 Unit Cell is shown top right and an example 3x3 array of cells is shown bottom right. The TTC wafers are available in either wire-bond (with inter-cell connection, so only periphery wire-bonding is required) or bump-chip (with each cell electrically isolated) form. Each wafer contains a 132x132 array of unit cells that can easily be sawn into various sub-array sizes to meet specific die dimensions in unit cell increments. The wafers can be thinned and backside treated on a custom basis.