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Thermal Characterization - TEA offers this service to customers having need for precise thermal parameter values for product data sheets, purchase specifications, specific application configurations, and/or device comparisons. This service is offered for a wide range of Discrete Devices (i.e., Bipolar Junction Transistors, MOSFETs, IGBTs, Diodes, SCRs, Triacs) and Integrated Circuits (i.e., digital, linear and mixed-signal devices). To learn more --
Please contact TEA to discuss your specific requirements; or
- Download the COMPONENT THERMAL TESTING QUESTIONAIRE (in pdf format) so it can be completed and faxed back to TEA; or - Download the COMPONENT THERMAL TESTING QUESTIONAIRE (in Word format) so it can completed and emailed back to TEA.
Contract Testing - This service addresses the thermal transient screening of medium and large devices lots for die attachment integrity. The information derived from this service is also useful for statistical control of the die/chip attachment process in production applications.
Referee Measurements - This service is offered to resolve difference in thermal test results between two or more parties (customer & supplier, between suppliers, etc.). TEA can review testing procedures of the parties and/or make fully-documented independent measurements on the same devices used for comparison by the parties involved.
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