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Phone: 650-961-5900
FAX: 650-227-3814
E-Mail: info@thermengr.com
Santa Clara, CA, USA

Standards Status

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SEMI Standards (Developed by US and Japanese Committees/Task Forces)

G30-88

SEMI Test Method: Junction-to-Case Thermal Resistance Measurments of Ceramic Packages

G32-87

SEMI Guidline: Unencapsulated Thermal Test Chip

G38-87

SEMI Test Method: Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages     (Replaced by G38-96)

G42-96

SEMI Specification: Thermal Test Board Standardization for Measuring Junction-to- Ambient Thermal Resistance of Semiconductor Packages

G43-87

SEMI Test Method:  Junction-to-Case Thermal Resistance Measurements of Molded-Plastic Packages

G46-88

SEMI Test Method: Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits

G38-96

SEMI Test Method:  Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages

G42-96

SEMI Specification: Thermal Test Board Standization for Measuring Junction-to- Ambient Thermal Resistance of Semiconductor Packages

G68-96

SEMI Test Method: Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Package

To obtain copies of these documents, please click on the linked standard number, visit the SEMI web site or contact:

SEMI - USA
3081 Zanker Road
San Jose, CA 95134 USA
Tel: 1.408.943.6900
Fax: 1.408.428.9600
Email: semihq@semi.org

SEMI - Japan
7F Kenwa Building
4-7-15 Kudan-miniami
Chiyoda-ku
Tokyo 102, Japan
Tel: 03-3222-5755
FAX: 03-3222-5757

SEMI - Europe
Avenue des Arts 40
Brussels, B-1040 Belgium
Tel: 32.2.289.6490
Fax: 32.2.511.4345
Email: semieurope@semi.org

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